Anti-flammable Compounds and Adhesive Materials
Todd S. Emrick, Ph.D.
- Novel compounds that impart flame retardancy
- Halogen-free anti-flammable adhesive materials
- Enables the preparation of halogen-free anti-flammable adhesive materials with exceptionally low hear release properties and high char residues
- Affords a broad range of adhesive formulations tailorable for specific end-use applications
This invention provides new chemical compositions and methods for the preparation of adhesive materials with low flammability. The low flammability is due to newly invented organic/polymeric components used in the adhesive formulation, rather than through the addition of a conventional anti-flammable additives such as halogenated organic molecules or phosphorous-containing structures.
Dr. Todd Emrick is a Professor in the Department of Polymer Science and Engineering. He is a prolific inventor and a Fellow of the National Academy of Inventors.
Available for Licensing and/or Sponsored Research
UMA 13-047
F
US Patent Issued: US 9,388,273
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